패널 본딩방법 및 장치

Panel bdnding method and apparatus

Abstract

본 발명에 따른, 패널 본딩장치는 패널을 공급받아 본딩위치로 로딩하는 로딩부와, 패널과 복수의 인쇄회로기판을 공급받아 본딩위치에 정렬하는 정렬부와, 정렬부에 접근 이격 가능하게 마련되어 복수의 인쇄회로기판을 패널에 동시에 본딩하는 본딩부와, 인쇄회로기판이 본딩된 패널을 정렬부로부터 비작업위치로 언로딩하는 언로딩부와, 패널을 로딩부로부터 정렬부를 거쳐 언로딩부로 이송시키는 이송부를 포함한다. 이에 의하여, 한 번의 압착으로 복수의 인쇄회로기판을 본딩할 수 있는 패널 본딩장치가 제공된다.
A panel bonding method and apparatus thereof are provided to bond a panel a plurality of printed circuit boards by one pressing operation by aligning the panel and the plurality of printed circuit boards at bonding positions, and simultaneously bonding the plurality of printed circuit boards to the panel. A loading unit(100) receives a panel(b) and loads the panel at a bonding position. An alignment unit receives the panel and a plurality of printed circuit boards(P1,P2) and align the panel and the plurality of printed circuit boards at bonding positions. A bonding unit(400) is provided to be movable toward or away from the alignment unit, and bonds the plurality of printed circuit boards to the panel simultaneously. An unloading unit(500) unloads the panel bonded with the printed circuit boards from the alignment unit to a non-operation position. A transfer unit(600) transfers the panel from the loading unit to the unloading unit via the alignment unit.

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    KR-101041847-B1June 17, 2011강정석, 안동규가변 실린더부를 구비한 듀얼 본딩장치